Raytek Semiconductor Inc. (abbreviated as Raytek) was funded in 2016, a high-tech semiconductor company dedicated to wafer-level packages. Raytek was established in Taiwan, and its vision is for the global market, focused on developing wafer-level packages and striving to be the most professional wafer-level RDL/Bumping supplier in Taiwan. Our services include the following:

• Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
• Copper Pillar Bump (CuP Bump)
• Lead-Free Bump (LF Bump)
• Wafer-level Chip Scale Package (WLCSP)
• Application: Cellphones, TVs, printers, monitors, appliances, digit cards, set-top-boxes, bio-chips, and Testing wafers.

• Front Side Metallization (FSM)
• Backside Grinding and Backside Metallization (BGBM)
• Application: Power discreet components such MOSFET and IGBT.

Raytek can provide one-stop and cost-efficient turnkey solutions to customers due to our strategic alliance with professional testing and assembly houses.

Raytek's management and technical team members come from worldwide top-tier assembly houses. The team members could be recognized as the pioneers of Taiwan wafer-level package development, and they deeply understand the history, development trend, and marketing demand in this field. IC design houses worldwide recognize our core team's technological capabilities and operation.

To meet the dynamic challenges in the WLP field, Raytek continues to enhance our core competency with our philosophy of "integrity, pragmatics, innovation, and win-win." We dedicate ourselves to providing excellent products, value-added services, and a working environment that stimulates employee growth. (encourages professional development)

The Raytek Team faces challenges with an open mind, striving for excellence at every opportunity presented. WE WILL NEVER GIVE UP.