Analysis capability for reliability & failure mode
Raytek introduced wafer level FIB , established the procedure of reliability & failure analysis. And continue to develop the necessary capability to match customer demanding in product reliability & quality.
| Categor | Equipment | Model | Capability |
|---|---|---|---|
| Reliability | HAST | KSON HAST-S PLUS | Temp: 105C~132C Humidity: 75% ~ 100% |
| HTS | ESPEC PV-212M | 20C~200C | |
| Failure Analysis | FE SEM | JEOL JSM-IT300HR | 5X ~ 600,000X |
| Ion Milling | JEOL IB-19500CP | Ion Bean Etching and Cutting | |
| Polisher | Struers Tegramin-20 | 40 ~ 600 rpm | |
| Cutter | Struers Minitom | Low‐speed precision cut-off | |
| Wafer Level SEM/FIB/EDS | FEI Helios 1200AT | Wafer level SEM for 300mm wafer |
Robot quality control system
Robot systems below were applied into production line to assure without any of human mistake happening
- EAP (Equipment Automation Program)
- RF ID
- SPC
- RMS (Recipe Management System)
- MES (Manufacturing Executive System
