Choosing Raytek to achieve your future As for the growing application of smart device in each area, such as IOT, Auto, smart home, healthy engineering, each kind of logic IC might need specialty DRAM to handle big data and graph-processing, and RDL process is the key component for the specialty DRAM.

Small form factor , lower power consumption, and high performance product with low cost creates strong market demand for RDL in memory, which can re-route I/O and make integration of MCP (Multi-Chip-Package) and SiP (System in Package) achievable.

Copper Pillar Bump improves the package capability for flip chip on substrate and flip chip on module since it could reach as small as 50 um fine bump pitch. The lead free solder tip (SnAg1.8%) can meet RoHS and Green Product requirement.

In the family of C4 solder bump, starting from Y1962 IBM high lead (Sn5Pb95) bump then people adopt eutectic bump (Sn63Pb37) for lower working temperature....

Analysis capability for reliability & failure mode Raytek has established the procedure of reliability & failure analysis. And continue to develop the necessary capability to match customer demanding in product reliability & quality.