Raytek can provide the services from RDL (Re-Distribution Layer) design, mask layout, tooling preparation. Raytek possesses state-of the-art design tools, professional and experienced designers, and design rule checking system to fulfill customer's specific package designs.

Raytek has established the capabilities of electrical characterizations to work closely with our customer for RDL RLC extraction to optimize the design work. Raytek team has abundant experience to serve customers. Raytek is developing the capabilities of signal integrity (SI) and power integrity (PI), thermal, mechanical , which covers thermal resistance (still air & forced air environments), package-level mechanical stress analysis, board-level solder fatigue and drop test analysis, for FOWLP development.