Definition of WLCSP is Package IC, compatible with standard PCB interconnect technology and with a size equal to the chip size, fabricated using wafer-level process. Currently, only plating technology is applied. Applications: DRAM, Nor Flash, FPGA, Communication Security Chip, Power Transistors.

Features

1. Wafer Size: 12-inch(300mm), 6-inch(150mm)
2. Structure & Material: Electroplating solder with SnAg 1.8%, SnAu 80%; Polyimide curing at 200°C (low temp) and 375°C (high temp)
3. Bump Height: Standard bump height is between 68um and 167um, adjusted according to customer requirements.
4. Design: Combined with Cu RDL to serve Wafer-level CSP applications, Raytek may provide wide UBM sizes such as 240um for thin WLCSP packages. This is very important for low form factor WLCSP demand for portable devices..
5. Turnkey Service: Provide WLCSP Turnkey Service, including Bumping, Test, Grinding, Dicing, Tape & Reel.

Applications

1. Applicable Products: DRAM, Nor Flash, FPGA, Communication Security Chip, Power Transistor, ...