隨著智慧型態在各領域不斷的擴大應用,例如IOT,Auto,smart home, healthy engineering, 擴量的數據及圖片處理變成各類型logic IC須借重特定DRAM才能滿足此項需求, 因此Specialty DRAM 的RDL因應而生,但最大的挑戰是來自於此市場特有的需求型態, 少量多樣,客製化的RDL, Time to Market.

Small form factor , lower power consumption, and high performance product with low cost creates strong market demand for RDL in memory, which can re-route I/O and make integration of MCP (Multi-Chip-Package) and SiP (System in Package) achievable.

Copper Pillar Bump improves the package capability for flip chip on substrate and flip chip on module since it could reach as small as 50 um fine bump pitch. The lead free solder tip (SnAg1.8%) can meet RoHS and Green Product requirement.

In the family of C4 solder bump, starting from Y1962 IBM high lead (Sn5Pb95) bump then people adopt eutectic bump (Sn63Pb37) for lower working temperature....

瑞峰半導體已建立可靠度與失效分析的程序，並持續發展必要的能力，以符合產品之品質與可靠度符合客戶要求。

Robot systems below were applied into production line to assure without any of human mistake happening